UKAM Industrial Superhard Tools

Precision. Performance. Consistency. These are the core attributes of the SMART CUT® Diamond Wafering Blades —the industry standard in sectioning and precision cutting applications. Designed for laboratory cutting, materials research, electronics, semiconductors, and quality control environments, these wafering blades deliver superior results with minimal material loss, deformation, or subsurface damage. At UKAM Industrial Superhard Tools, we’ve redefined what a diamond wafering blade can do, offering a complete line of diamond and CBN wafering blades tailored for hard, brittle, and soft materials. Whether you're cutting glass, ceramics, semiconductors, metals, composites, or geological samples, our SMART CUT® blades provide the ultimate control and precision. What Are Diamond Wafering Blades? Diamond wafering blades are thin, precision cutting tools embedded with diamond particles on the edge or throughout the blade matrix. These blades are used in sectioning machines and low-...

The SMART CUT® Fine Grinding Fixed Abrasive Plates provide an advanced solution for high-precision surface grinding, material removal, and finishing applications. Designed for superior flatness, durability, and efficiency, these abrasive plates eliminate the need for loose abrasives, resulting in a cleaner, more cost-effective grinding process. At UKAM Industrial Superhard Tools, we specialize in precision grinding solutions tailored for metals, ceramics, composites, and other hard materials. Key Features of SMART CUT® Fine Grinding Plates ✔ Fixed Abrasive Technology – Ensures consistent material removal and surface finish . ✔ Superior Flatness & Parallelism – Delivers highly accurate, uniform surfaces . ✔ Eliminates Loose Abrasives – Reduces contamination and cleanup time . ✔ Longer Service Life – High-quality diamond and CBN abrasives extend plate longevity . ✔ Customizable Sizes & Grits – Available for different material types and applications . Applications of S...

The SMART CUT® Glass Blade is designed for high-precision cutting of glass and other brittle materials, ensuring minimal chipping, clean edges, and superior surface finish. Manufactured using advanced diamond bonding technology, these blades are ideal for industrial, laboratory, and manufacturing applications that require precision, durability, and efficiency. At UKAM Industrial Superhard Tools, we provide specialized diamond tools engineered for cutting optical glass, fused silica, borosilicate, quartz, and more. Key Features of SMART CUT® Glass Blades ✔ Precision Diamond Bonding – Optimized for smooth, chip-free cutting of glass and brittle materials. ✔ Ultra-Thin Kerf – Reduces material loss and increases yield, crucial for high-value materials. ✔ Minimal Heat Generation – Prevents thermal damage and stress cracks. ✔ High Cutting Efficiency – Achieves faster, cleaner cuts with less vibration. ✔ Customizable Sizes & Grits – Available in various thicknesses, diameters, a...

The SMART CUT® Series 305M Diamond Wafering Blades are engineered for h igh-precision cutting of hard, brittle, and delicate materials such as ceramics, glass, semiconductors, composites, and metals. These metal-bonded diamond blades provide exceptional durability, minimal chipping, and precise material removal, making them ideal for laboratory and industrial applications requiring micron-level accuracy. At UKAM Industrial Superhard Tools, we specialize in advanced diamond wafering blades designed to deliver superior performance, longer lifespan, and unmatched cutting precision. Key Features of SMART CUT® Series 305M Diamond Wafering Blades ✔ Metal Bond Diamond Technology – Ensures extended blade life and consistent performance . ✔ Superior Edge Quality – Produces clean, smooth cuts with minimal chipping . ✔ Ultra-Thin Kerf – Reduces material loss and maximizes yield, essential for expensive materials. ✔ Optimized for Precision Cutting – Ideal for laboratory, semiconductor, op...